new-blue-globe

Nano Silver Sintered Silver adhesive

2026-02-13

Nano Silver Sintered Silver adhesive

                  Epoxy-based high thermal conductivity sintered silver adhesive combines the mechanical stability of a thermosetting epoxy matrix with the superior thermal conductivity of sintered silver particles. It is widely used in power module packaging, LED thermal management, and automotive electronics. This material system disperses nano- or micron-scale silver particles within a functionalized epoxy matrix and undergoes partial low-temperature sintering under mild conditions below 300 °C. The process forms a continuous silver network, effectively increasing thermal conductivity to above 20–100 W/m·K while maintaining excellent mechanical bonding strength.

◆ Semi-sintered




◆ Fully-sintered

Nano-Scale Fully Sintered Die-Attach Silver Paste – FP-6100-HP9

Suitable for semiconductor packaging designs requiring high electrical and thermal conductivity. To achieve optimal performance, the die and substrate surfaces must be gold- or silver-plated. This resin-free formulation enables pure metallic bonding, significantly enhancing thermal dissipation.
 

Applications:

  1. High-power packaging products

  2. Packaging for high-temperature operating environments

  3. SiP / QFN / LGA / HBLED

Features:

  1. Excellent high-temperature shear strength; outstanding electrical conductivity

  2. Compatible with adhesive stamping and dispensing processes

  3. Superior thermal conductivity

  4. Low-temperature sintering capability (180–200 °C)



Back