With the rapid growth of the optical communications industry, optical modules generate higher power and heat under high-speed, large-data transmission. This places stricter demands on adhesives in terms of heat resistance, dimensional stability, and reliability.
To meet mainstream market requirements, Fitop Technology introduces the light/thermal dual-curing adhesive EP-28-3410-50K, specifically engineered for high-precision optical communication components. It is ideal for optical module alignment, fixation, and packaging applications.
Product Features & Advantages
✔ Fast UV Curing for Positioning
Delivers excellent UV curing response, enabling rapid positioning in a short time and improving precision assembly efficiency.
✔ Low Coefficient of Thermal Expansion (Low CTE)
Maintains dimensional stability under thermal cycling, ensuring long-term alignment accuracy of optical communication components.
✔ Wide Adhesion Compatibility
Provides reliable bonding across various substrates, including:
Glass, metals, PEI, PCB, ceramics, gold-plated surfaces, aluminum, FeNi alloys, and more.
✔ Superior Environmental Resistance
Combines good thermal conductivity, heat resistance, and sealing performance. Offers water resistance and withstands high/low temperature shock, making it suitable for harsh operating environments.
✔Technical Data Download:
